High Speed Fine Wire Wedge Bonder - Bondjet BJ820 - Hesse Mechatronics

High Speed Fully Automatic Fine Wire Wedge Bonder BJ820 for wire and ribbon 17.5-50 µm. www.hesse-mechatronics.com MORE Videos on www.wirebonddemo.com The Bondjet BJ820 is the world´s leading fully automated fine wire wedge wedge bonder. The BJ820 is ready for all wire bonding challenges on a single platform, using wires and ribbons made of aluminium, copper and gold. Typical applications are components in the HF and RF technology, COB, MCM and hybrids, opto and automotive electronics. The BJ820 defines the latest state of technological development compared to the competition and is benchmark for: The highest bonding speed in the industry The largest working area of fast running fine wire bonders The greatest axis accuracy