Further improving the award-winning NT-H1, Noctua’s NT-H2 thermal compound uses a new, fine-tuned mixture of metal oxide micro-particles for even lower thermal resistance and reduced bond-line thickness at typical mounting pressures. This allows it to achieve an even better performance in most application scenarios, making it ideal for enthusiasts looking for that slight cooling edge. This video shows you what kind of differences in performance can you expect to achieve and which factors you should keep in mind when testing thermal compounds.
Also see:
How to apply NT-H1 on smaller-sized CPUs (e.g. Intel LGA1150, LGA1151, LGA1155, LGA1156)? https://bit.ly/2G7tb0D
How to apply NT-H1 on medium-sized CPUs (e.g. AMD AM4, Intel LGA2011 & LGA2066)? https://bit.ly/2MCHvzD
How to apply NT-H1 on larger-sized CPUs (e.g. AMD TR4, Intel LGA3647)? https://bit.ly/2sUQd2Z
How to apply NT-H2 on smaller-sized CPUs (e.g. Intel LGA1150, LGA1151, LGA1155, LGA1156)? https://bit.ly/2RROOt4
How to apply NT-H2 on medium-sized CPUs (e.g. AMD AM4, Intel LGA2011 & LGA2066)? https://bit.ly/2RoQwxb
How to apply NT-H2 on larger-sized CPUs (e.g. AMD TR4, Intel LGA3647)? https://bit.ly/2TjDdzI
How to clean NT-H2 using the NA-CW1 wipes: https://bit.ly/2CNs1UW
Product information:
3.5g package: https://noctua.at/en/nt-h1
10g package: https://noctua.at/en/nt-h1-10g
3.5g package: https://noctua.at/en/nt-h2-3-5g
10g package: https://noctua.at/en/nt-h2-10g
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